70T3509MS133BPI Quick Packaging Info

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タイトル 情報
Product Number: 70T3509MS133BPI
Pkg. Description: CHIP ARRAY BGA 17.0 X 17.0 MM X 1.0 MM P
Pkg. Code: BP256
Lead Count: 256
Length: 17
Width: 17
Thickness: 1.8
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Category: 240
Pb (Lead) Free: いいえ
JEDEC Standard: MO-192
タイトル 情報
Carrier Type: Tray
Qty. per Carrier: 90
Pkg. Type: CABGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 3
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0