89H64H16AG2ZCBLG Quick Packaging Info

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タイトル 情報
Product Number: 89H64H16AG2ZCBLG
Pkg. Description: FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH
Pkg. Code: BLG1156
Lead Count: 1156
Length: 35
Width: 35
Thickness: 2.8
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: G
Pb (Lead) Free: はい
タイトル 情報
Carrier Type: Tray
Qty. per Carrier: 24
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 245
Pb Free Category: e1 SnAgCu