タイトル 情報
Package Description CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Package Status Active
Package Type CABGA
クラス PLASTIC
Package Code BF208
カテゴリ 240
Lead Count 208
Pb (Lead) Free No
長さ 15mm
Pb Free Category e0
15mm
Thickness 1.4mm
Peak Reflow Temp 225.00°C
Pitch 0.8mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 15.0 x 15.0 x 1.4

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
PCN / PDN
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BC/BCG 196 & BF/BFG 208/289 SHIPPING TRAY Carrier / Package Type PDF 105 KB
BB/BBG 160, BF/BFG 208/289 & BG/BGG 121 CARRIER TAPE Drawings PDF 28 KB
BF PACKAGE OUTLINE 9.0 x 13.0 mm BODY FPBGA Package Outline Drawing PDF 238 KB
BF208 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB
BF208 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 258 KB