タイトル 情報
Package Description CHIP ARRAY BGA 5.5 X 13.5 MM X 0.8 MM PI
Package Status Active
Package Type CABGA
クラス PLASTIC
Package Code BF96
カテゴリ 240
Lead Count 96
Pb (Lead) Free No
長さ 13.5mm
Pb Free Category e0
5.5mm
Thickness 1.4mm
Peak Reflow Temp 225.00°C
Pitch 0.8mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 13.5 x 5.5 x 1.4

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
PCN / PDN
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB
PCN# : A-0610-01 Transfer of IDT Penang Assembly to AIT Product Change Notification PDF 174 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB
PCN# : A-0607-02 IDT Penang as Alternate Assembly Facility for ICS CVBGA and FPBGA Product Change Notification PDF 101 KB
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BF/BFG 96 CARRIER TAPE Carrier / Package Type PDF 27 KB
BF/BFG 96 SHIPPING TRAY Carrier / Package Type PDF 158 KB
BF PACKAGE OUTLINE 9.0 x 13.0 mm BODY FPBGA Package Outline Drawing PDF 238 KB
BF96 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 287 KB
BF96 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 526 KB