タイトル 情報
Package Description CHIP ARRAY BGA 4.5MM X 7MM X 0.65MM PITC
Package Status Active
Package Type CABGA
クラス PLASTIC
Package Code BVG56
カテゴリ G
Lead Count 56
Pb (Lead) Free Yes
長さ 7mm
Pb Free Category e1 SnAgCu
4.5mm
Thickness 1mm
Peak Reflow Temp 260.00°C
Pitch 0.65mm
Package Carrier Reel, Tray
Pkg. Dimensions 7.0 x 4.5 x 1.0

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
PCN / PDN
PCN# : A-0610-01 Transfer of IDT Penang Assembly to AIT Product Change Notification PDF 174 KB
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
BV/BVG52/56 SHIPPING TRAY Carrier / Package Type PDF 349 KB
13" PLASTIC REEL WITH 7" HUB Carrier / Package Type PDF 54 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BV/BVG 52/56 CARRIER TAPE Carrier / Package Type PDF 25 KB
BV/BVG PACKAGE OUTLINE 5 x 12 mm. BODY SIZE 0.65 mm BALL PITCH FPBGA Package Outline Drawing PDF 276 KB
BVG56 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 310 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB
BV/BVG PACKAGE OUTLINE 4.5 X 7.0 MM BODY 0.65 MM PITCH CVBGA Carrier / Package Type PDF 107 KB
BVG56 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 513 KB