タイトル 情報
Package Description TSSOP 4.4 MM 0.65MM PITCH
Package Status Active
Package Type TSSOP
クラス PLASTIC
Package Code PG20
カテゴリ 240
Lead Count 20
Pb (Lead) Free No
長さ 6.5mm
Pb Free Category e0
4.4mm
Thickness 1mm
Peak Reflow Temp 240.00°C
Pitch 0.65mm
Package Carrier Reel, Tube
Pkg. Dimensions (mm) 6.5 x 4.4 x 1.0

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
PCN / PDN
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notification PDF 147 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notification PDF 298 KB
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 7" HUB Carrier / Package Type PDF 54 KB
COVER TAPE Carrier / Package Type PDF 28 KB
EN/ENG 16, EJ/EJG 20/24, PF/PFG, PG/PGG 14/16/20/24/28 SHIPPING TUBE Carrier / Package Type PDF 26 KB
PG/PGG 20 CARRIER TAPE Carrier / Package Type PDF 29 KB
PG20 Coper Wire IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 282 KB
PG20 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 282 KB
PG20 Copper Wire IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 517 KB
PG20 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 517 KB