タイトル 情報
Package Description SOIC 300 MIL
Package Status Active
Package Type SOIC
クラス PLASTIC
Package Code PS16
カテゴリ 240
Lead Count 16
Pb (Lead) Free No
長さ 10.4mm
Pb Free Category e0
7.6mm
Thickness 2.34mm
Peak Reflow Temp 225.00°C
Pitch 1.27mm
Package Carrier Tube
Pkg. Dimensions (mm) 10.4 x 7.6 x 2.34

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
PCN / PDN
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notification PDF 147 KB
PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility Product Change Notification PDF 490 KB
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil Product Change Notification PDF 223 KB
PCN# L-0607-01R1 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 379 KB
PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products Product Change Notification PDF 305 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notification PDF 298 KB
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 7" HUB Carrier / Package Type PDF 54 KB
COVER TAPE Carrier / Package Type PDF 28 KB
PI/PIG 16/20, PS/PSG 16/20/24/28 & PV/PVG 48/56 SHIPPING TUBE Carrier / Package Type PDF 26 KB
PI/PIG 16 & PS/PSG 16 CARRIER TAPE Carrier / Package Type PDF 23 KB
SOIC MARKETING DRAWING (.050" PITCH) (EIAJ) Package Outline Drawing PDF 134 KB
PS/PSG/PI/PIG PACKAGE OUTLINE .300" BODY WIDTH SOIC .050" PITCH Carrier / Package Type PDF 159 KB
PS16 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 517 KB
PS16 Copper Wire IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 517 KB
PS16 Copper Wire IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 758 KB
PS16 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 758 KB