The 71V3578 3.3V CMOS SRAM is organized as 256K x 18. The 71V3578 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

Features

  • High system speed 150MHz (3.8ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 3.3V I/O
  • Available in 100 -pin TQFP package

Product Options

注文可能な製品ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
71V3578S133PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V3578S133PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V3578S133PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V3578S133PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability
71V3578S150PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V3578S150PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V3578S150PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V3578S150PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability

技術資料

タイトル 他の言語 タイプ 形式 サイズ 日付
データシート
71V3576_71V3578 Datasheet PDF 180 KB
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 Product Change Notice PDF 138 KB
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES Product Change Notice PDF 101 KB
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines Product Change Notice PDF 120 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notice PDF 194 KB
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black Product Change Notice PDF 729 KB
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter Product Change Notice PDF 163 KB
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB
PCN#: A-0403-03, BGA package family Product Change Notice PDF 38 KB
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material Product Change Notice PDF 211 KB
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB
PCN#:A-0305-02, new m/c G770 & 2300 d/a material Product Change Notice PDF 197 KB
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB
PCN#:G-0303-01, new m/c G700 & 3230 d/a material Product Change Notice PDF 138 KB
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB
PCN SR0201-01 Die rev,Z(cemos 10) to Y (cemos11.5) Product Change Notice PDF 22 KB
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB

ソフトウェア/ツール

タイトル 他の言語 タイプ 形式 サイズ 日付
71v3578_BG IBIS Model Model - IBIS ZIP 9 KB
71V3578_PF IBIS Model Model - IBIS ZIP 9 KB
71V3578 Verilog Model Model - Verilog TAR 92 KB