The 71V632 3.3V CMOS SRAM is organized as 64K x 32. The pipelined burst architecture provides cost-effective 3-1-1-1 secondary cache performance for processors up to 117MHz. The 71V632 SRAM contains write, data, address, and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

Features

  • High system speed 4.5ns clock access time (117 MHz)
  • Single-cycle deselect functionality (Compatible with
  • Micron Part # MT58LC64K32D7LG-XX)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte
  • write enable (BWE), and byte writes (BWx)
  • Power down controlled by ZZ input
  • Operates with a single 3.3V power supply (+10/-5%)
  • Available in 100-pin TQFP package

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
71V632S5PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V632S5PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability
71V632S6PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V632S6PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability
71V632S7PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V632S7PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V632S7PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V632S7PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability

技術資料

タイトル 他の言語 タイプ フォーマット ファイルサイズ 日付
データシート
71V632 Data Sheet Datasheet PDF 755 KB 2月 24, 2017
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB 8月 25, 2016
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB 11月 13, 2012
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB 5月 9, 2006
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB 7月 18, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB 12月 13, 2004
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB 10月 9, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB 3月 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB 3月 19, 2003
PCN#:G-0303-01, new m/c G700 & 3230 d/a material Product Change Notice PDF 138 KB 3月 10, 2003
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB 6月 16, 2002
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB 4月 25, 2002
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB 12月 13, 2001
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB 6月 10, 2001
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB 11月 17, 1999
ソフトウェア/ツール
71V632_PF IBIS Model Model - IBIS ZIP 9 KB 8月 13, 2000
71V632 Verilog Model Model - Verilog ZIP 15 KB 8月 31, 1998

ソフトウェア/ツール

タイトル 他の言語 タイプ フォーマット ファイルサイズ 日付
71V632_PF IBIS Model Model - IBIS ZIP 9 KB 8月 13, 2000
71V632 Verilog Model Model - Verilog ZIP 15 KB 8月 31, 1998