The 71V67803 3.3V CMOS SRAM is organized as 512K x 18. The 71V67803 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

Features

  • High system speed 166MHz (3.5ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 3.3V I/O supply (VDDQ)
  • Available in 100-pin TQFP, 119-pin BGA and 165 fpBGA packages

Product Options

Orderable Part ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
71V67803S133BG Active BG119 PBGA 119 C No Tray
Availability
71V67803S133BG8 Active BG119 PBGA 119 C No Reel
Availability
71V67803S133BGG Active BGG119 PBGA 119 C Yes Tray
Availability
71V67803S133BGG8 Active BGG119 PBGA 119 C Yes Reel
Availability
71V67803S133BQ Active BQ165 CABGA 165 C No Tray
Availability
71V67803S133BQG Active BQG165 CABGA 165 C Yes Tray
Availability
71V67803S133BQG8 Active BQG165 CABGA 165 C Yes Reel
Availability
71V67803S133BQGI Active BQG165 CABGA 165 I Yes Tray
Availability
71V67803S133BQI Active BQ165 CABGA 165 I No Tray
Availability
71V67803S133PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V67803S133PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V67803S133PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V67803S133PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability
71V67803S150BG Active BG119 PBGA 119 C No Tray
Availability
71V67803S150BG8 Active BG119 PBGA 119 C No Reel
Availability
71V67803S150BQ Active BQ165 CABGA 165 C No Tray
Availability
71V67803S150BQ8 Active BQ165 CABGA 165 C No Reel
Availability
71V67803S150BQI Active BQ165 CABGA 165 I No Tray
Availability
71V67803S150PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V67803S150PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V67803S150PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V67803S150PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability
71V67803S166BG Active BG119 PBGA 119 C No Tray
Availability
71V67803S166BG8 Active BG119 PBGA 119 C No Reel
Availability
71V67803S166BQ Active BQ165 CABGA 165 C No Tray
Availability
71V67803S166BQG Active BQG165 CABGA 165 C Yes Tray
Availability
71V67803S166BQG8 Active BQG165 CABGA 165 C Yes Reel
Availability
71V67803S166PFG Active PKG100 TQFP 100 C Yes Tray
Availability
71V67803S166PFG8 Active PKG100 TQFP 100 C Yes Reel
Availability
71V67803S166PFGI Active PKG100 TQFP 100 I Yes Tray
Availability
71V67803S166PFGI8 Active PKG100 TQFP 100 I Yes Reel
Availability

技術資料

タイトル 他の言語 タイプ フォーマット ファイルサイズ 日付
データシート
71V67603/803 Datasheet Datasheet PDF 236 KB 11月 16, 2014
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 567 KB 8月 25, 2016
PCN#: A1309-03 Additional Assembly Sources Product Change Notice PDF 398 KB 10月 20, 2013
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB 11月 13, 2012
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 Product Change Notice PDF 138 KB 7月 24, 2007
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES Product Change Notice PDF 101 KB 7月 23, 2007
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines Product Change Notice PDF 120 KB 12月 16, 2006
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notice PDF 194 KB 8月 29, 2006
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China Product Change Notice PDF 164 KB 5月 9, 2006
PCN#: TB-0512-01 Reel Color Changed from Blue to Black Product Change Notice PDF 729 KB 12月 15, 2005
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter Product Change Notice PDF 163 KB 8月 2, 2005
PCN A-0506-03; Packing Material Change Product Change Notice PDF 290 KB 7月 18, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB 12月 13, 2004
PCN#: A-0403-03, BGA package family Product Change Notice PDF 38 KB 12月 8, 2004
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material Product Change Notice PDF 211 KB 10月 15, 2003
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB 10月 9, 2003
PCN#:A-0305-02, new m/c G770 & 2300 d/a material Product Change Notice PDF 197 KB 6月 3, 2003
PCN#: G-0302-06, New die attach 3230 from Ablestik Product Change Notice PDF 150 KB 3月 19, 2003
PCN#G-0302-05, New mold compound EME-G700 series Product Change Notice PDF 65 KB 3月 19, 2003
PCN#:G-0303-01, new m/c G700 & 3230 d/a material Product Change Notice PDF 138 KB 3月 10, 2003
PCN# G-0206-08, Orientation of square PQFP & TQFP Product Change Notice PDF 150 KB 6月 16, 2002
PCN# G-0110-06 REV.1 Mold Compound Product Change Notice PDF 48 KB 4月 25, 2002
PCN# G-0110-06 Mold Compound Product Change Notice PDF 47 KB 12月 13, 2001
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB 6月 10, 2001
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB 11月 17, 1999
ソフトウェア/ツール
71v67803z_PF IBIS Model Model - IBIS ZIP 13 KB 8月 13, 2000

ソフトウェア/ツール

タイトル 他の言語 タイプ フォーマット ファイルサイズ 日付
71v67803z_PF IBIS Model Model - IBIS ZIP 13 KB 8月 13, 2000