The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-accuracy amplification and analog-to digital conversion of a differential or pseudo-differential input signal. Designed for high-resolution sensor module applications, the ZSSC3224 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected sensor values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via a 26-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3224 is simple via the serial interface. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. The ZSSC3224 provides accelerated signal processing, increased resolution, and improved noise immunity in order to support high-speed control, safety, and real-time sensing applications with the highest requirements for energy efficiency.

Features

  • Flexible, programmable analog front-end design,up to 24-bit analog-to-digital converter (ADC)
  • Fully programmable gain amplifier for optimizing sensor signals: gain range 6.6 to 216 (linear)
  • Internal auto-compensated 18-bit temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain as well as 1st and 2nd order temperature gain and offset drift
  • Programmable interrupt operation
  • High-speed sensing: e.g., 18-bit conditioned sensor signal measurement rate >200s-1
  • Typical sensor elements can achieve an accuracy of better than ±0.10% full-scale output at -40 to 85°C

Product Options

注文可能な製品ID Part Status 説明 Pkg. Code Pkg. Type Lead Count (#) Temp. Range Carrier Type 購入/サンプル
ZSSC3224BI1B Active 304μm thickness DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3224BI2B Active 725μm thickness DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3224BI3R Active NLG24 VFQFPN 24 -40 to 85°C Reel
Availability

技術資料

タイトル 他の言語 タイプ 形式 サイズ 日付
データシート
ZSSC3224 Short-form Datasheet Short Form Datasheet PDF 133 KB
ZSSC3224 Datasheet Datasheet PDF 974 KB
ユーザーガイド
Choosing the Right Sensor Signal Conditioning IC Guide PDF 300 KB
ZSSC3224-KIT Evaluation Kit Description Manual PDF 4.08 MB
アプリケーションノート、ホワイトペーパー
IDT Wafer Dicing Guidelines Application Note PDF 44 KB
その他資料
Sensing Technologies and Sensor Solutions Overview 简体中文 Overview PDF 1.66 MB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications (日本語) English Overview PDF 6.88 MB

ソフトウェア/ツール

タイトル 他の言語 タイプ 形式 サイズ 日付
ZSSC3224 Evaluation Kit Software Rev. 1.1 Software ZIP 8.09 MB

Evaluation Boards