70T631S10BF Quick Packaging Info

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タイトル 情報
Product Number: 70T631S10BF
Pkg. Description: CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Pkg. Code: BF208
Lead Count: 208
Length: 15
Width: 15
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: 240
Pb (Lead) Free: いいえ
JEDEC Standard: MO-205
タイトル 情報
Carrier Type: Tray
Qty. per Carrier: 126
Pkg. Type: CABGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0