80RWM6050BALGI Quick Packaging Info

アクティブ

タイトル 情報
Product Number: 80RWM6050BALGI
Pkg. Description: FLIP CHIP BGA 19.0 X 19.0 MM X 0.8 MM
Pkg. Code: ALG484
Lead Count: 484
Length: 19
Width: 19
Thickness: 2.7
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: G
Pb (Lead) Free: はい
タイトル 情報
Carrier Type: Tray
Qty. per Carrier: 84
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 245
Pb Free Category: e1 SnAgCu