タイトル 情報
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
クラス PLASTIC
Package Code HLG676
カテゴリ G
Lead Count 676
Pb (Lead) Free Yes
長さ 27mm
Pb Free Category e1 SnAgCu
27mm
Thickness 3.2mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 27.0 x 27.0 x 3.2

Documentation

タイトル 他の言語 タイプ 形式 サイズ 日付
その他資料
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BB/BBG416, BG/BGG256/272, BH/BHG580/675, BL/BLG676, BR672/676, BX/BXG420, HL/HLG/HMG/RM676 & HM/HMG/HMH/RM675 SHIPPING TRAY Carrier / Package Type PDF 95 KB
BL/BLG676, BR672/676 & HL/HLG676 CARRIER TAPE Carrier / Package Type PDF 27 KB
HL/HR/HLG676 PACKAGE OUTLINE (27 x 27 mm Body; 1.0 mm Pitch; FCBGA; Hat Lid) Package Outline Drawing PDF 195 KB
HLG676 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 263 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB