The QS32XL384 provides a set of twenty high-speed CMOS TTLcompatible bus switches. The low ON resistance of the QS32XL384 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Four Bus Enable signals are provided, one for each of five bits of the 20-bit bus. The QS32XL384 is ideal for switching wide digital buses, as well as hot-docking, 5V to 3V conversion and capacitance isolation for power conservation. The QS32XL384 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to VCC
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Four enables control five bits each
  • TTL-compatible input and output levels
  • Available in 48-pin QVSOP package

Product Options

注文可能な製品ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
QS32XL384Q1G Obsolete DJG48 QVSOP 48 C Yes Tube
Availability
QS32XL384Q1G8 Obsolete DJG48 QVSOP 48 C Yes Reel
Availability

技術資料

タイトル 他の言語 タイプ 形式 サイズ 日付
データシート
QS32XL384 Datasheet Datasheet PDF 215 KB
Errata LEN-02-01: pin swap Errata PDF 100 KB
アプリケーションノート、ホワイトペーパー
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB
Quickswitch Basics Application Note PDF 83 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCN / PDN
PDN# : CQ-15-04 Quarterly Market Declined PDN Product Discontinuation Notice PDF 545 KB
PCN# : A1301-01 Gold to Copper Wire Product Change Notice PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages Product Change Notice PDF 102 KB
PCN#: TB-0510-05 New Shipping Tube for TSSOP/TVSOP/TSSOP Exposed Product Change Notice PDF 201 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN# L0203-10R2 Fab 2 to Fab4 Transfer Product Change Notice PDF 112 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB

ソフトウェア/ツール

タイトル 他の言語 タイプ 形式 サイズ 日付
QS32XL384 Hspice Model Model - HSPICE ZIP 5 KB
QS32XL384 IBIS Model Model - IBIS ZIP 4 KB